DE-RAY made
- COB VCSEL Manufacturer
COB VCSE
DE-RAY specializes in the R&D and production of COB VCSELs (Chip-On-Board Vertical Cavity Surface Emitting Lasers). Leveraging advanced packaging technology and superior light source performance, we deliver efficient and stable laser solutions to our customers. Our products are widely applied in 3D sensing, optical communications, LiDAR, and other fields, supporting both finished product wholesale and multi-specification customization to meet diverse industry demands.
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High Power, High Efficiency, Exceptional Beam Quality
COB packaging integrates numerous VCSEL chips within a compact area, achieving high power output and superior electro-optical conversion efficiency. The vertically emitted beam exhibits high consistency with a perfectly round spot, facilitating precise optical design and coupling.
Benefits
Combining the high efficiency of VCSELs with the high integration and thermal management advantages of COB.
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Superior Thermal Management, Stable and Reliable
Chips are directly bonded to the substrate for rapid heat dissipation, supporting sustained high-power operation. The simplified structure minimizes failure points, ensuring long-term stable performance. -
Miniaturization and High Integration
Eliminating separate packaging steps enables thinner, smaller components, reducing system size and complexity while facilitating highly integrated product designs. -
Flexible Customization with Controlled Costs
Customizable wavelength, power, array configuration, and beam profile meet diverse applications including 3D sensing, LiDAR, industrial ranging, medical imaging, and optical communications. COB manufacturing is well-suited for mass production, lowering both manufacturing and maintenance costs.
Partnerships
Serving global head medical brands and industrial head sensor companies, ensuring the quality and continuous innovation of VCSEL Laser Diode.
What is it used for?
3D Sensing and Facial Recognition
Enables structured light or TOF (Time-of-Flight) 3D imaging through high-precision beam arrays for smartphones, tablets, access control systems, and human-machine interaction.
LiDAR (Light Detection and Ranging)
Serves as a light source for autonomous driving, robot navigation, and surveying/mapping applications, offering high power, long-range capabilities, and wide field-of-view advantages.
Industrial Ranging and Visual Inspection
Enables precise distance measurement, position detection, surface profiling, and defect inspection in industrial automation.
Optical Communications and Data Centers
Serves as an efficient, low-power light source for high-speed, short-range data transmission, meeting demands in data centers, optical interconnects, and optical backplanes.
Medical and Life Sciences
Used in precision optical medical devices for bio-detection, laser surgery, skin therapy, and wearable health monitoring.
AR/VR/MR Display and Interaction
Serves as projection and position-tracking light sources, delivering more precise perception and interactive experiences for augmented reality, virtual reality, and mixed reality devices.
Customer Feedback
After adopting COB VCSEL technology, our 3D sensing module has shrunk by over 30% in size. Simultaneously, the spot consistency for 3D facial recognition has significantly improved, enabling faster and more stable unlocking speeds. The high power density allows us to maintain compact dimensions while ensuring reliable performance during extended use.
Optical Engineering Director
Leading Smartphone Brand in East Asia
The high integration and superior thermal performance of COB VCSEL packaging provide a reliable light source solution for our 400-meter range solid-state LiDAR. Even under rigorous high-temperature testing conditions, power attenuation remains extremely low—critical for automotive mass production applications.
Hardware Lead
Autonomous Driving LiDAR
In high-precision medical scanners, our COB VCSEL achieves micron-level beam uniformity, guaranteeing scan accuracy. The module's stability and low power consumption significantly reduce equipment maintenance costs while alleviating hospitals' long-term operational burdens.
R&D Director
European Medical Imaging Solutions Company
we’re here to all your questions
Here are the most common questions about COB VCSELs. If you have additional inquiries, feel free to consult our support specialists at no charge.
What distinguishes COB VCSEL from traditionally packaged VCSEL?
COB (Chip On Board) involves directly bonding the VCSEL chip onto the packaging substrate, followed by array configuration and optical processing. Compared to traditional single-chip packaging, COB significantly enhances integration density, reduces size, improves thermal performance, and lowers packaging costs. It is highly suitable for high-power, multi-channel applications.
What is the lifespan and reliability of COB VCSELs?
Thanks to direct mounting and simplified interconnect paths, COB VCSELs reduce solder joints and connectors, lowering failure risks. Combined with VCSELs’ inherent stability under varying temperatures and currents, they achieve stable operation exceeding 20,000 hours—or longer—with proper thermal management.
What are the primary application scenarios for COB VCSELs?
Typical applications include 3D sensing and facial recognition, LiDAR, industrial ranging and vision inspection, optical communications, medical and life sciences, AR/VR interaction, and other scenarios demanding high-power, highly consistent beams and miniaturization.